Abstract: 

The storage stability of tantalum capacitors is a very important issue in electronic equipment and assembly, and it is also one of the hotspots of the current research. Several problems in the application of tantalum capacitors were summarized and analyzed, combined with the moisture absorption characteristics of molded packaging materials and the absorption and expansion theory of the moisture, the failure mechanism in temperature shock and reflow soldering of the tantalum capacitors in the presence of moisture was interpreted. A new kind of tantalum capacitor encapsulation material and method were tried to improve itsmoisture resistance. 

Several rigorous tests and 85 ℃-85% RH-2000 h life test show that the material and technology plays a very important role for the improvement of the storage stability of tantalum capacitor.

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